Medicept Bond Plus Nt Total-Etch Single-Component Adhesive System

DESCRIPTION

Bond Plus NT

• BondPlus NT is 15% filled with 0.4 micron barium glass (also found in the Medicept Flash composite).
• This unique technology provides the highest level of protection against micro leakage, while sustaining high bond strengths to a variety of surfaces.
• The filler not only reinforces the hybrid zone, but penetrates the dentin tubules as well, creating a true “structural bond” not found in unfilled or even “nano” filled adhesive systems.
• With BondPlus NT, adhesion promoters are carried in an ethanol solvent, diminishing both the tedious need for multiple coats and constant reapplication commonly found with acetone adhesives.
• BondPlus NT is indicated for both direct and indirect bonding applications

FEATURES

• Structural bond with dentin tubule penetration
• 15% filled with barium glass for reinforcement
• Versatile for direct and indirect bonding applications
• Solvent-free for convenience and efficiency
• High bond strength and durability
• Excellent marginal seal to enamel and dentin
• Universally accepted and proven worldwide

SPECIFICATIONS

• Shear Bond Strength: 16.4Mpa
• Micro-Tensile Bond Strength To Dentine: 25MPa
• Micro-Tensile Bond Strength To Dnamel: 31MPa
• Marginal Seal To Enamel: 100%
• Marginal Seal To Dentine: 99%

PACKING

5 ml bottle